PRODUCTS

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32, 64, 96-channel DIN 41612

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32, 64, 96-channel DIN 41612

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.50 x 2.50 mm; 37 x 62 soldering pads 2.20 mm Ø

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.50 x 2.50 mm; 37 x 62 soldering pads 2.20 mm Ø

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.50 x 2.50 mm; connector 31-channel DIN 41617

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.50 x 2.50 mm; connector 31-channel DIN 41617

Metriclab Card; FR4 1.50 mm single-sided 35 µm Cu; 90.17 x 95.89 mm; spacing 2.00 x 2.00 mm

CEM3 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 x 61 soldering pads

FR4 1.50 mm double-sided 35 µm Cu (plated through holes); Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 x 61 soldering pads

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 x 61 soldering pads

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 x 61 soldering pads

FR4 1.50 mm double-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 x 61 soldering pads

HF-Board; FR4 1.50 mm double-sided 35 µm Cu; spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612

CEM3 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 x 61 soldering pads 2.20 x 2.20 mm

CEM3 1.50 mm single-sided 35 µm Cu; size 100 x 220 mm; spacing 2.54 x 2.54 mm; 38 x 85 soldering pads 2.20 x 2.20 mm

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; horizontal and vertical conductor paths

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; horizontal and vertical conductor paths

FR4 1.50 mm double-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; horizontal and vertical conductor paths

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 31-channel DIN 41617

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 31-channel DIN 41617

FR4 1.50 mm double-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 31-channel DIN 41617

FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; Europeformat 100 x 160 mm; connector D-Sub DIN 41652

FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; Europeformat 100 x 160 mm; connector D-Sub DIN 41652

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector D-Sub DIN 41652

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector D-Sub DIN 41652

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector D-Sub 2 x 37-channel DIN 41652

FR4 1.50 mm single-sided 35 µm Cu; 114.30 x 165.10 mm; spacing 2.54 x 2.54 mm; square soldering pads

FR4 1.50 mm single-sided 35 µm Cu; 114.30 x 165.10 mm; spacing 2.54 x 2.54 mm; 4 rows DIP IC grid 7.62 mm

FR4 1.50 mm double-sided 35 µm Cu (plated through); 114.30 x 165.10 mm; spacing 2.54 x 2.54 mm

FR4 1.50 mm single-sided 35 µm Cu; double Europeformat 160 x 233.40 mm; spacing 2.54 x 2.54 mm; 61 x 87 soldering pads

CEM3 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 3-hole-pads

CEM3 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 220 mm; spacing 2.54 x 2.54 mm; 3-hole-pads

CEM3 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 580mm; spacing 2.54 x 2.54 mm; 3-hole-pads

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32/65/96-channel DIN 41612

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32/65/96-channel DIN 41612

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32-channel, DIN 41612

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32-channel DIN 41612

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 64-channel DIN 41612

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 64-channel DIN 41612

FR2 1.50 mm single-sided 35 µm; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 64-channel DIN 41612

FR4 1.50 mm single-sided 35 µm; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 64-channel DIN 41612

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612

FR4 1.50 mm double-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612

FR4 1.50 mm double-sided 35 µm Cu (plated through); spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612

FR4 1.50 mm double-sided 35 µm Cu (plated through); spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; connector 32-channel/D, 48-channel/E, 48-channel/F DIN 41612

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; connector 32-channel/D, 48-channel/E, 48-channel/F DIN 41612

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 2 x connector 32/64/96-channel DIN 41612

Multibus II Board; FR4 1.50 mm single-sided 35 µm Cu; 100 x 220 mm; connector 32/64/96-channel DIN 41612

Multibus II Board; FR4 1,50 mm double-sided 35 µm Cu (plated through); spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612

Multibus II Board; FR4 1.50 mm double-sided 35 µm Cu (plated through); spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612

HF-Board; FR4 1.50 mm double-sided 35 µm Cu (plated through); connector 32/64/96-channel DIN 41612

FR4 0,80 mm double-sided 35 µm Cu (plated through); 53 x 95 mm; SMD-breadboard 1.25 x 1.25 mm; 40 x 60 soldering pads

FR4 0,80 mm double-sided 35 µm Cu (plated through); 53 x 95 mm; SMD-breadboard 1.27 x 1.27 mm; 39 x 59 soldering pads

SMD-Mix; FR4 0.80 mm double-sided 35 µm Cu (plated through); spacing 1.27 x 1.27 mm & 2.54 x 2.54 mm; connector 32/64/95-channel DIN 41612

FR4 1.50 mm double-sided 35 µm Cu (plated through); spacing 1.27 x 1.27 mm; connector 32/64/96-channel DIN 41612

FR4 1.50 mm double-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 1.27 x 1.27 mm; 8588 soldering pads

PGA-Board; FR4 1.50 mm double-sided 35 µm Cu; interstitial spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612

FR4 1.50 mm single-sided 35 µm Cu; without holes; Europeformat 100 x 160 mm; approx. 40 different QFP-, SOP-, SSOP-, SDIP-casings

PLCC-, QFP-modules; 120 x 175 mm; adaption circuit board for 23 different SMD-Ics (plated through)

Adaption circuit board for PLCC 32, 52, 68, 84 (1.27 mm) and QFP 100 (0.635 mm) and QFP 100 (0.50 mm)

Multiadapter QFP 144 (plated through); surface chem. Au; two universal QFP layouts for various housing sizes and pin numbers

Multiadapter QFP 240 (plated through); surface chem. Au; two universal QFP layouts for various housing sizes and pin numbers

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.50 x 2.50 mm; 39 strips with 61 holes

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.50 x 2.50 mm; 39 strips with 61 holes

CEM3 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160mm; spacing 2.54 x 2.54 mm; 38 strips

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 strips with 61 holes

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 strips with 61 holes

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 strips with 61 holes

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 strips with 61 holes

FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 strips with 57 holes; connector 32-channel DIN 41612

FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 strips with 57 holes; connector 32-channel DIN 41612

FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 strips with 61 holes; connector 31-channel DIN 41612

FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 strips with 61 holes; connector 31-channel DIN 41612

FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 strips with 61 holes; direct connector 37-channel

FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 strips with 61 holes; direct connector 37-channel

FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 36 strips with 61 holes; connector 32 -channel DIN 41612

FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 36 strips with 61 holes; connector 32 -channel DIN 41612

FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 x 57 soldering pads; connector 32-channel DIN 41612

FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 x 57 soldering pads; connector 32-channel DIN 41612

FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 36 strips with 56 holes; connector H 15 DIN 41612

FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 36 strips with 56 holes; connector H 15 DIN 41612

FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 38 strips with 57 holes; connector 32/64/96-channel DIN 41612

FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 38 strips with 57 holes; connector 32/64/96-channel DIN 41612

FR4 1.50 mm single-sided 35 µm Cu; 100 x 140 mm; Pick & Place; 57 different SMD components

FR4 1.50 mm single-sided 35 µm Cu; 100 x 140 mm; Pick & Place; 85 different SMD components

FR4 1.50 mm single-sided 35 µm Cu; 100 x 140 mm; solder stop mask & additional print: 4 x QFP P=0.40 / 15.7 mil.

FR4 1.50 mm single-sided 35 µm Cu; double Europeformat 160 x 233.40 mm; spacing 2.54 x 2.54 mm; connector 32/64/96-pol. DIN 41612

SMD-TSOP I/II Multiadapter; FR4 1.50 mm double-sided 35 µm Cu (plated through); 14 different TSOP I & 7 different TSOP II

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSOP I, pitch 0.40 mm, pins 20, 40, 48, 60

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSOP I, pitch 0.50 mm, pins 28, 32, 40, 48

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSOP I, pitch 0.65 mm, pins 16, 24, 28, 36

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSOP II, pitch 1.27 mm, pins 20, 24, 26, 28, 32

SSOP-SMD Multiadapter (shrink small outline package); adaption circuit board for 7 different SSOP

FR4 1.50 mm double-sided 35 µm Cu (plated through); SSOP 16, pitch 0.65 mm; designed in a single row

FR4 1.5 mm double-sided 35 µm Cu (plated through); SSOP 28, pitch 0.65 mm; designed in a single row

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 8, pitch 1.27 mm; designed in a single row

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 14, pitch 1.27 mm; designed in a single row

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 16, pitch 1.27 mm; designed in a single row

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 16w, pitch 1.27 mm; designed in a single row

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 20w, pitch 1.27 mm; designed in a single row

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 24w, pitch 1.27 mm; designed in a single row

TSSOP-SMD Multiadapter (thin shrink small outline package); adaption circuit board for 10 differents TSSOP

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 8, pitch 0.65 mm; designed in a single row

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 14, pitch 0.65 mm; designed in a single row

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 16, pitch 0.65 mm; designed in a single row

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 20, pitch 0.65 mm; designed in a single row

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 28, pitch 0.65 mm; designed in a single row
Roth Elektronik Produkte
- FR4-Platinen in verschiedenen Stärken und mit unterschiedlichen Kupferbeschichtungen, sowohl einseitig als auch zweiseitig.
- FR2-Platinen ohne Kupferbeschichtung mit standardisierten Rastern für vielseitige Anwendungen.
- CEM3-Platinen mit verbesserter Temperaturbeständigkeit und Stabilität, ideal für Anwendungen mit höheren thermischen Anforderungen.
- Diverse Laborkarten in unterschiedlichen Größen und Rastermaßen, geeignet für spezifische experimentelle und Entwicklungszwecke.
- Platinen im Europaformat mit unterschiedlichen Kupferstärken, Rastern und Steckverbindern, konform zu DIN 41612.
- Spezielle Adaptacks-Basisplatinen und selbstklebende Kontaktleisten in verschiedenen Pitch-Größen für benutzerdefinierte Anwendungen.
- Diese Produkte werden gemäß aktuellen RoHS- und REACH-Vorschriften von ISO-zertifizierten Produktionspartnern nach UL-Norm gefertigt, was ihre Qualität und Zuverlässigkeit gewährleistet. Roth Elektronik setzt somit neue Standards in der Entwicklung und Herstellung von Prototypenplatinen, die eine breite Palette von Anwendungen in der Elektronikindustrie abdecken.