PRODUCTS
FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32, 64, 96-channel DIN 41612
FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32, 64, 96-channel DIN 41612
FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.50 x 2.50 mm; 37 x 62 soldering pads 2.20 mm Ø
FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.50 x 2.50 mm; 37 x 62 soldering pads 2.20 mm Ø
FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.50 x 2.50 mm; connector 31-channel DIN 41617
FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.50 x 2.50 mm; connector 31-channel DIN 41617
Metriclab Card; FR4 1.50 mm single-sided 35 µm Cu; 90.17 x 95.89 mm; spacing 2.00 x 2.00 mm
CEM3 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 x 61 soldering pads
FR4 1.50 mm double-sided 35 µm Cu (plated through holes); Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 x 61 soldering pads
FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 x 61 soldering pads
FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 x 61 soldering pads
FR4 1.50 mm double-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 x 61 soldering pads
HF-Board; FR4 1.50 mm double-sided 35 µm Cu; spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612
CEM3 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 x 61 soldering pads 2.20 x 2.20 mm
CEM3 1.50 mm single-sided 35 µm Cu; size 100 x 220 mm; spacing 2.54 x 2.54 mm; 38 x 85 soldering pads 2.20 x 2.20 mm
FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; horizontal and vertical conductor paths
FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; horizontal and vertical conductor paths
FR4 1.50 mm double-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; horizontal and vertical conductor paths
FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 31-channel DIN 41617
FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 31-channel DIN 41617
FR4 1.50 mm double-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 31-channel DIN 41617
FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; Europeformat 100 x 160 mm; connector D-Sub DIN 41652
FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; Europeformat 100 x 160 mm; connector D-Sub DIN 41652
FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector D-Sub DIN 41652
FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector D-Sub DIN 41652
FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector D-Sub 2 x 37-channel DIN 41652
FR4 1.50 mm single-sided 35 µm Cu; 114.30 x 165.10 mm; spacing 2.54 x 2.54 mm; square soldering pads
FR4 1.50 mm single-sided 35 µm Cu; 114.30 x 165.10 mm; spacing 2.54 x 2.54 mm; 4 rows DIP IC grid 7.62 mm
FR4 1.50 mm double-sided 35 µm Cu (plated through); 114.30 x 165.10 mm; spacing 2.54 x 2.54 mm
FR4 1.50 mm single-sided 35 µm Cu; double Europeformat 160 x 233.40 mm; spacing 2.54 x 2.54 mm; 61 x 87 soldering pads
CEM3 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 3-hole-pads
CEM3 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 220 mm; spacing 2.54 x 2.54 mm; 3-hole-pads
CEM3 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 580mm; spacing 2.54 x 2.54 mm; 3-hole-pads
FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32/65/96-channel DIN 41612
FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32/65/96-channel DIN 41612
FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32-channel, DIN 41612
FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32-channel DIN 41612
FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 64-channel DIN 41612
FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 64-channel DIN 41612
FR2 1.50 mm single-sided 35 µm; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 64-channel DIN 41612
FR4 1.50 mm single-sided 35 µm; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 64-channel DIN 41612
FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612
FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612
FR4 1.50 mm double-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612
FR4 1.50 mm double-sided 35 µm Cu (plated through); spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612
FR4 1.50 mm double-sided 35 µm Cu (plated through); spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612
FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; connector 32-channel/D, 48-channel/E, 48-channel/F DIN 41612
FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; connector 32-channel/D, 48-channel/E, 48-channel/F DIN 41612
FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 2 x connector 32/64/96-channel DIN 41612
Multibus II Board; FR4 1.50 mm single-sided 35 µm Cu; 100 x 220 mm; connector 32/64/96-channel DIN 41612
Multibus II Board; FR4 1,50 mm double-sided 35 µm Cu (plated through); spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612
Multibus II Board; FR4 1.50 mm double-sided 35 µm Cu (plated through); spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612
HF-Board; FR4 1.50 mm double-sided 35 µm Cu (plated through); connector 32/64/96-channel DIN 41612
FR4 0,80 mm double-sided 35 µm Cu (plated through); 53 x 95 mm; SMD-breadboard 1.25 x 1.25 mm; 40 x 60 soldering pads
FR4 0,80 mm double-sided 35 µm Cu (plated through); 53 x 95 mm; SMD-breadboard 1.27 x 1.27 mm; 39 x 59 soldering pads
SMD-Mix; FR4 0.80 mm double-sided 35 µm Cu (plated through); spacing 1.27 x 1.27 mm & 2.54 x 2.54 mm; connector 32/64/95-channel DIN 41612
FR4 1.50 mm double-sided 35 µm Cu (plated through); spacing 1.27 x 1.27 mm; connector 32/64/96-channel DIN 41612
FR4 1.50 mm double-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 1.27 x 1.27 mm; 8588 soldering pads
PGA-Board; FR4 1.50 mm double-sided 35 µm Cu; interstitial spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612
FR4 1.50 mm single-sided 35 µm Cu; without holes; Europeformat 100 x 160 mm; approx. 40 different QFP-, SOP-, SSOP-, SDIP-casings
PLCC-, QFP-modules; 120 x 175 mm; adaption circuit board for 23 different SMD-Ics (plated through)
Adaption circuit board for PLCC 32, 52, 68, 84 (1.27 mm) and QFP 100 (0.635 mm) and QFP 100 (0.50 mm)
Multiadapter QFP 144 (plated through); surface chem. Au; two universal QFP layouts for various housing sizes and pin numbers
Multiadapter QFP 240 (plated through); surface chem. Au; two universal QFP layouts for various housing sizes and pin numbers
FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.50 x 2.50 mm; 39 strips with 61 holes
FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.50 x 2.50 mm; 39 strips with 61 holes
CEM3 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160mm; spacing 2.54 x 2.54 mm; 38 strips
FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 strips with 61 holes
FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 strips with 61 holes
FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 strips with 61 holes
FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 strips with 61 holes
FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 strips with 57 holes; connector 32-channel DIN 41612
FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 strips with 57 holes; connector 32-channel DIN 41612
FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 strips with 61 holes; connector 31-channel DIN 41612
FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 strips with 61 holes; connector 31-channel DIN 41612
FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 strips with 61 holes; direct connector 37-channel
FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 strips with 61 holes; direct connector 37-channel
FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 36 strips with 61 holes; connector 32 -channel DIN 41612
FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 36 strips with 61 holes; connector 32 -channel DIN 41612
FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 x 57 soldering pads; connector 32-channel DIN 41612
FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 x 57 soldering pads; connector 32-channel DIN 41612
FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 36 strips with 56 holes; connector H 15 DIN 41612
FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 36 strips with 56 holes; connector H 15 DIN 41612
FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 38 strips with 57 holes; connector 32/64/96-channel DIN 41612
FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 38 strips with 57 holes; connector 32/64/96-channel DIN 41612
FR4 1.50 mm single-sided 35 µm Cu; 100 x 140 mm; Pick & Place; 57 different SMD components
FR4 1.50 mm single-sided 35 µm Cu; 100 x 140 mm; Pick & Place; 85 different SMD components
FR4 1.50 mm single-sided 35 µm Cu; 100 x 140 mm; solder stop mask & additional print: 4 x QFP P=0.40 / 15.7 mil.
FR4 1.50 mm single-sided 35 µm Cu; double Europeformat 160 x 233.40 mm; spacing 2.54 x 2.54 mm; connector 32/64/96-pol. DIN 41612
SMD-TSOP I/II Multiadapter; FR4 1.50 mm double-sided 35 µm Cu (plated through); 14 different TSOP I & 7 different TSOP II
FR4 1.50 mm double-sided 35 µm Cu (plated through); TSOP I, pitch 0.40 mm, pins 20, 40, 48, 60
FR4 1.50 mm double-sided 35 µm Cu (plated through); TSOP I, pitch 0.50 mm, pins 28, 32, 40, 48
FR4 1.50 mm double-sided 35 µm Cu (plated through); TSOP I, pitch 0.65 mm, pins 16, 24, 28, 36
FR4 1.50 mm double-sided 35 µm Cu (plated through); TSOP II, pitch 1.27 mm, pins 20, 24, 26, 28, 32
SSOP-SMD Multiadapter (shrink small outline package); adaption circuit board for 7 different SSOP
FR4 1.50 mm double-sided 35 µm Cu (plated through); SSOP 16, pitch 0.65 mm; designed in a single row
FR4 1.5 mm double-sided 35 µm Cu (plated through); SSOP 28, pitch 0.65 mm; designed in a single row
FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 8, pitch 1.27 mm; designed in a single row
FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 14, pitch 1.27 mm; designed in a single row
FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 16, pitch 1.27 mm; designed in a single row
FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 16w, pitch 1.27 mm; designed in a single row
FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 20w, pitch 1.27 mm; designed in a single row
FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 24w, pitch 1.27 mm; designed in a single row
TSSOP-SMD Multiadapter (thin shrink small outline package); adaption circuit board for 10 differents TSSOP
FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 8, pitch 0.65 mm; designed in a single row
FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 14, pitch 0.65 mm; designed in a single row
FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 16, pitch 0.65 mm; designed in a single row
FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 20, pitch 0.65 mm; designed in a single row
FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 28, pitch 0.65 mm; designed in a single row
Roth Elektronik Produkte
- FR4-Platinen in verschiedenen Stärken und mit unterschiedlichen Kupferbeschichtungen, sowohl einseitig als auch zweiseitig.
- FR2-Platinen ohne Kupferbeschichtung mit standardisierten Rastern für vielseitige Anwendungen.
- CEM3-Platinen mit verbesserter Temperaturbeständigkeit und Stabilität, ideal für Anwendungen mit höheren thermischen Anforderungen.
- Diverse Laborkarten in unterschiedlichen Größen und Rastermaßen, geeignet für spezifische experimentelle und Entwicklungszwecke.
- Platinen im Europaformat mit unterschiedlichen Kupferstärken, Rastern und Steckverbindern, konform zu DIN 41612.
- Spezielle Adaptacks-Basisplatinen und selbstklebende Kontaktleisten in verschiedenen Pitch-Größen für benutzerdefinierte Anwendungen.
- Diese Produkte werden gemäß aktuellen RoHS- und REACH-Vorschriften von ISO-zertifizierten Produktionspartnern nach UL-Norm gefertigt, was ihre Qualität und Zuverlässigkeit gewährleistet. Roth Elektronik setzt somit neue Standards in der Entwicklung und Herstellung von Prototypenplatinen, die eine breite Palette von Anwendungen in der Elektronikindustrie abdecken.