Order quantity |
Price (net) |
01-09 pcs |
per 10.26 € |
10-24 pcs |
per 9.98 € |
25-49 pcs |
per 9.79 € |
50-99 pcs |
per 9.69 € |
>100 pcs |
per 9.50 € |
Product details
- Epoxy fibre-glass FR4 1.50 mm
- Double-sided 35 µm Cu
- Plated through holes (PTH)
- Surface chem. Ni/Au with solder stop mask
- Adaption circuit board for TSOP I 20, 24 (0.50 mm)
- Hole diameter 1.00 mm
- Gerber data for manufacture of the soldering paste imprint will be provided free of charge on request
Module-No. |
Type |
Pitch |
Pin |
Size (mm) |
RE900-03 |
TSOP I |
0.500 mm |
20, 24 |
6.00 x 16.00 |
Key information
All prices are plus statutory VAT ex works.
For further information please refer to our General Terms and Conditions of Business.
Minimum order of 100.00 EUR for delivery.
We supply only trade customers (companies as defined in §14 of the BGB [German Civil Code]), schools, universities and public institutions.
Private Users are asked to approach our distributors.